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Grinn Introduces the Grinn GenioSOM-360: High-Performance Edge AI in the World’s Smallest Form Factor

POST by
Kateryna Kozakova Kateryna Kozakova

Published Mar 05, 2026
Category Hardware, Success Stories
Read time 2 minutes
Table of Contents

Big things really do come in small packages. Today at the Embedded World exhibition, Grinn announced the launch of the Grinn GenioSOM-360. This new addition to the Grinn Genio product family is the world’s smallest System-on-Module (SOM) powered by the newly released MediaTek Genio 360P processor.

Earlier this month, MediaTek announced the Genio 360P processor, and Grinn is ensuring that the development community does not have to wait to begin their work. By offering the Grinn GenioSOM-360 immediately, Grinn makes it possible for engineers to start testing and implementing this latest technology today.

"Our goal is to simplify the path from a complex idea to a finished product," said Robert Otręba, CEO of Grinn. "Utilizing this platform into a compact footprint, we are providing a versatile tool for the next generation of Edge AI. This module proves that high performance and a tiny form factor can go hand-in-hand."

"The MediaTek Genio 360P platform is designed to bring sophisticated intelligence to a wider range of IoT devices," said Sameer Sharma, AVP of the MediaTek IoT Business Group. "Through our continued collaboration with Grinn, we look forward to seeing how developers use the Grinn GenioSOM-360 to quickly bring these new capabilities to market."

Measuring just 30x30mm in a compact LGA package, the GenioSOM-360 is designed for developers who need to integrate advanced artificial intelligence and high-speed processing into space-constrained applications. Despite its small size, the GenioSOM-360 is a robust platform featuring:

  • Processor: Octa-core architecture (2x Arm Cortex-A76 and 6x Arm Cortex-A55).
  • AI & Graphics: 8th generation MediaTek NPU and ARM Mali G57 MC2 GPU.
  • Memory: Up to 8 GB LPDDR4X-3733 and eMMC 5.1 storage.
  • Connectivity: PCIe Gen2, USB 3.0, 2x USB 2.0, RGMII, and CAN-FD.
  • Display/Audio: Support for MIPI DSI, LVDS, eDP, DP, and multiple audio interfaces (I2S, TDM, PCM, PDM).

The Grinn GenioSOM-360 is built to handle the diverse needs of today’s tech landscape. It is a natural fit for industrial automation, where it can power everything from smart controllers to high-resolution HMI panels. The module is also an excellent choice for healthcare, providing the reliable processing needed for portable diagnostic tools and patient monitoring. Beyond that, it's ready for smart city infrastructure, offering the power required for advanced security cameras and edge computing hubs to analyze data right where it’s collected.


Kateryna Kozakova Marketing Manager

Kateryna is a devoted Marketing Manager at Grinn, handling marketing and events, enhancing brand visibility and engagement.

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