system-on-module

Grinn UltraLiteSOM-6 (LiteSOM)

The SO-DIMM form factor makes it easy to embed to the device without any technical issues. By placing the most critical signals in the module, even very complex peripherals can be placed using two PCB layers. This allows the delivery of cost-performance optimised designs and speeds up time to market.

Wiki page
Fields of application
  • IOT
  • Home automation
  • HMI
  • Industrial controllers
  • Gateway
  • Smart appliances
Supporting
  • BuildRoot
Specification
  • Processor
    • i.MX 6UltraLite, 528 MHz
    • ARM® Cortex®- A7 Core
  • Memory
    • DDR3 up to 512MB
  • Storage
    • eMMC 2GB
  • OS suport
    • Linux, Brillo
  • Multimedia
    • Parallel 24/16/10/8-bit
    • Display Interface up to WXGA (1366x768)
    • Parallel 24/16/10/8-bit
    • Camera Sensor Interface
    • 3x I2S
    • 8x8 keypad
    • Medium quality sound
    • Touch screen controller
    • PiXel Processing Pipeline
  • Connectivity
    • 2x 10/100 Ethernet
    • 2x USB2.0 OTG
    • 2x CAN
    • 8x UART
    • 4x SPI
    • 4x I2C
    • 3x I2S
    • S/PDIF Tx/Rx
    • 8x8 keypad
    • 2x ADC(12-bit, 10-ch)
  • Security
    • Crypto Engine (AES with DPA, TDES/SHA/RSA)
    • Tamper Monitor
    • Secure Boot
    • SIMV2/EVMSIM X 2
    • OTF DRAM Encryption
  • Size
    • 67.6mm x 26.5mm x 3mm
  • Connector
    • 200 pin SO-DIMM
  • Operating Temperature
    • Commercial: 0 to +85° C
    • Extended: -25 to +85° C
    • Industrial: -40 to 105° C
  • Power Supply
    • Single 3.3V DC
Grinn UltraLiteSOM-6 (LiteSOM)
ready-to-use

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REVIEWED ON
4.8 / 5.0

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