The SO-DIMM form factor makes it easy to embed to the device without any technical issues. By placing the most critical signals in the module, even very complex peripherals can be placed using two PCB layers. This allows the delivery of cost-performance optimised designs and speeds up time to market.
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A compact, high-performance reference design that brings reliable satellite-based IoT connectivity
The Grinn GenioSOM-700 is a high-performance System on Module designed for advanced AI and IoT applications.
Delivering 25 TOPS of native INT8 performance, the Grinn GenioBoard with the DEEPX DX-M1 M.2 Module enables high-throughput AI inference directly at the edge.
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