The SO-DIMM form factor makes it easy to embed to the device without any technical issues. By placing the most critical signals in the module, even very complex peripherals can be placed using two PCB layers. This allows the delivery of cost-performance optimised designs and speeds up time to market.
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Other products
System on Module featuring an octa-core processor (Cortex-A76 + A55), MediaTek 8th-gen NPU, and Mali G57 GPU - all in a compact, 30x30mm form factor. Ideal for Edge AI, industrial automation, and space-constrained applications.
System on Module featuring a dual-core Cortex-A55 processor, Mali-G31 GPU, and a dedicated 1 TOPs NPU. The world's smallest SoM at 25x25mm - ideal for compact Edge AI and industrial IoT applications.
Grinn GenioEVB-700 is a versatile evaluation board built to showcase the capabilities of the Grinn GenioSOM-700 module.
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