The SO-DIMM form factor makes it easy to embed to the device without any technical issues. By placing the most critical signals in the module, even very complex peripherals can be placed using two PCB layers. This allows the delivery of cost-performance optimised designs and speeds up time to market.
Other products
Grinn ReneSOM-V2H a compact, high-performance embedded platform powered by the Renesas RZ/V2H vision AI processor, designed for intelligent edge applications.
Grinn Test Add-on expands the Synaptics® Coralboard™ with DSI-to-HDMI, USB-to-UART, status indicators, a buzzer, and multi-rail power monitoring.
Grinn GenioSOM-360 is a compact 30×30 mm System on Module powered by the MediaTek® Genio 360 (MT8366) processor, built for everyday edge AI and IoT applications.
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